{"id":4886,"date":"2024-03-28T11:16:04","date_gmt":"2024-03-28T10:16:04","guid":{"rendered":"https:\/\/www.possehlelectronics.de\/expertise\/etching-technology\/"},"modified":"2025-03-06T14:18:50","modified_gmt":"2025-03-06T13:18:50","slug":"etching-technology","status":"publish","type":"page","link":"https:\/\/www.possehlelectronics.de\/en\/expertise\/etching-technology\/","title":{"rendered":"Etching technology"},"content":{"rendered":"
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Expertise and decades of experience: Etching technology at Possehl Electronics<\/strong><\/h1>\n\n\t<\/div>\n\n<\/div>\n\n\n
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Produced etched parts p.a.<\/h3>\n\n\n\n~<\/span>40000000<\/span> pcs.<\/span><\/span>\n\n\t<\/div>\n\n<\/div>\n\n\n
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Materials<\/h4>\n\n\n\n
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  • Copper alloys with a thickness of 0.102 mm (4 mil) to 0.508 mm (20 mil)<\/li>\n\n\n\n
  • The most important copper alloys are C19400, C70250, EFTEC-64T and C15150 with different hardness and tempering to meet the various packing requirements.<\/li>\n<\/ul>\n<\/div>\n\n\n\n
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    Surface coating<\/h4>\n\n\n\n
      \n
    • By using the photo-mask technology we are able to achieve a positioning accuracy of +\/-0.025 mm as well as a point-to-point spacing of at least 0.10 mm, both for Ag and for NiPdAu, on one or both sides.<\/li>\n\n\n\n
    • To improve the adhesion, we can roughen the copper surface on one or both sides prior to the coating process.<\/li>\n<\/ul>\n<\/div>\n\n\n\n
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      Etching<\/h4>\n\n\n\n
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      • We have the know-how to process highly complex designs with features such as cavity depth, deep etching, wettable flanks (dimples) and much more besides.<\/li>\n<\/ul>\n<\/div>\n\n\n\n
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        Treatment<\/h4>\n\n\n\n
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        • To improve the enclosure reliability (MSL-Level), we apply a proprietary treatment method to one or both sides of the copper surface to increase the mechanical locking performance.<\/li>\n<\/ul>\n<\/div>\n\n\n\n
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          Tools<\/h4>\n\n\n\n
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          • In-house production of printing templates and glass masks.<\/li>\n<\/ul>\n<\/div>\n\n\n\n
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            Machinery\/Equipment<\/h4>\n\n\n\n
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            • High-speed reel-to-reel chemical etching process<\/li>\n\n\n\n
            • High-precision exposure process for design imaging<\/li>\n\n\n\n
            • Precise backside-strip-taping, lead\/DAP offset, strip cutting<\/li>\n\n\n\n
            • Auto vision inspection systems are used in our process<\/li>\n<\/ul>\n<\/div>\n\n\n\n
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              Lead frame enclosure offer<\/h4>\n\n\n\n
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              • Enhance Cavity QFN-Design for a thinner enclosure<\/li>\n\n\n\n
              • Flipchip-QFN design with thin\/long lines<\/li>\n\n\n\n
              • Deep half etching (on dambar) for 20mil QFN<\/li>\n\n\n\n
              • Selective coating both for an Ag and NiPdAu finish<\/li>\n\n\n\n
              • Etching ID marking on the pad<\/li>\n\n\n\n
              • Extension of the strip size up to 100×290 mm<\/li>\n\n\n\n
              • One-panel-wide lead frame design<\/li>\n\n\n\n
              • Super High Density design (>14,000 units per strip)<\/li>\n\n\n\n
              • Routable QFN lead frame design with 0.102 mm (4 mil) and 0.127 mm (5 mil) copper alloy thickness<\/li>\n\n\n\n
              • Fine Inner Lead Pitch up to 0.081 mm at a copper alloy thickness of 0.102 mm (4 mil)<\/li>\n\n\n\n
              • Multi-Pad Long Lead design QFN (under development)<\/li>\n<\/ul>\n\n\n\n

                <\/p>\n<\/div>\n\n\t<\/div>\n\n<\/div>\n\n<\/div>\n\n \n <\/section>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":2,"featured_media":4396,"parent":4815,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":""},"class_list":["post-4886","page","type-page","status-publish","has-post-thumbnail","hentry"],"acf":[],"yoast_head":"\nEtching technology - Possehl Electronics<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.possehlelectronics.de\/en\/expertise\/etching-technology\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Etching technology - Possehl Electronics\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.possehlelectronics.de\/en\/expertise\/etching-technology\/\" \/>\n<meta property=\"og:site_name\" content=\"Possehl Electronics\" \/>\n<meta property=\"article:modified_time\" content=\"2025-03-06T13:18:50+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.possehlelectronics.de\/wp-content\/uploads\/2024\/04\/373_Produkte.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1920\" \/>\n\t<meta property=\"og:image:height\" content=\"690\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.possehlelectronics.de\/en\/expertise\/etching-technology\/\",\"url\":\"https:\/\/www.possehlelectronics.de\/en\/expertise\/etching-technology\/\",\"name\":\"Etching technology - 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